Blue Power Automation Equipment
The Company devotes itself to professional high-precision laser micro processing as well as development and manufacturing of high-precision measuring devices.
Suzhou BLUE POWER Automatic Equipment Technology Co., Ltd. incorporated in Kunshan National Hi-tech Industrial Development Zone is a hi-tech enterprise specialized in development of high-precision automatic devices. The Company was founded based on the Laser Device R&D Department established by POWER GROUP in Shenzhen in 2005. The Company has developed domestic high-precision laser devices like SMT laser stencil cutting machine and so on and has accumulated more than ten years of experience in high-precision laser device development technologies.
The Company devotes itself to professional high-precision laser micro processing as well as development and manufacturing of high-precision measuring devices. The Company possesses one professional team of optical, mechanical and electrical integration and software development and design. The Company owns the completely independent intellectual property rights of products. Our products mainly include high-precision laser drillers, laser cutting machines, chip bonding machines, Die Shift automatic detection system, SMT laser detection devices, etc. These products are mainly applied to HDI circuit boards, semiconductor encapsulation, solar cells, medical devices, laser precision metal micro processing, ultra-thin glass processing and detection. Wherein, Die Shift automatic detection system and chip bonding machines are advanced in China, and relevant products and technologies have reached the advanced level in the industry, which has solved the problem that some devices can only be accessed through import and has realized replacement with domestic products. The Company’s products have been widely recognized by many customers on the market, such as Intel, Ximai, etc.
DIE Shift automatic detection system
Our products can be applied to the semiconductor chip packaging field to automatically scan and obtain the coordinate of feature points and the relative location on the Die and generate the corresponding diagram according to the relative location for further processing.
News Information
02
2022-12
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